论文部分内容阅读
以Ti3AlC2和Cu粉作为原料,在1150℃下原位热压反应制备了具有亚微米层状结构的Ti3C2/(Cu-Al)金属陶瓷材料。XRD、SEM和TEM分析表明,这种亚微米层状结构的形成,归因于Ti3AlC2与Cu的高温反应引发Ti3AlC2层状结构解离、Al原子溶脱,固溶入周围的Cu中形成Cu-Al固溶体,Al溶出后的Ti3AlC2中原始Ti3C2层规律性聚集、最终形成厚度为150nm左右的Ti3C2层与Cu-Al层交替层叠结构。由于这两种结构之间的牢固结合以及Cu-Al相构成的空间网络结构,使得此金属陶瓷材料具有优异的力学性能和电学性能。其抗弯强度超过1200MPa,并具有良好的断裂韧性和导电性。
Ti3C2 / (Cu-Al) cermet with submicron lamellar structure was prepared by hot pressing in situ at 1150 ℃ with Ti3AlC2 and Cu powder as raw materials. The results of XRD, SEM and TEM show that the formation of this submicron lamellar structure is attributed to the dissociation of the Ti3AlC2 layer structure due to the high temperature reaction between Ti3AlC2 and Cu, the dissolution of Al atoms, and the solid solution into the surrounding Cu to form Cu-Al In the solid solution, the original Ti3C2 layer in Ti3AlC2 after the dissolution of Al is regularly aggregated, and the Ti3C2 layer and the Cu-Al layer are alternately laminated to a thickness of about 150 nm. Due to the strong bonding between the two structures and the spatial network structure of the Cu-Al phase, the cermet material has excellent mechanical and electrical properties. The flexural strength of more than 1200MPa, and has good fracture toughness and electrical conductivity.