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研究指出,Ni的添加导致Ag-Cu-In-Sn合金固—液相线温度升高,结晶间隔△t值增大,但在相同Ni含量的合金中,上述影响会随着合金内Sn含量的增加而减弱;微量Ni可明显地提高合金在Ni、Cu等母材上的润湿性和漫流性,并使钎接母材的接头强度显著改善。
It is pointed out that the addition of Ni results in the increase of the solid-liquidus temperature and the Δt value of the crystallization interval in Ag-Cu-In-Sn alloys. However, in the same Ni content alloy, ; Ni addition can obviously improve the wettability and flowability of the alloy on base metal such as Ni and Cu, and improve the joint strength of the base metal.