为推进国内电子互连技术及互连材料的发展和创新,作为“2006年中国国际工业博览会论坛”的重要组成部分,上海电子制造行业协会、上海市电子学会、上海交通大学、日本大阪大学于2006年11月17日~18日在上海联合举办了“2006上海电子互连技术及材料国际论坛”。本次论坛的内容函括 In order to promote the development and innovation of domestic electronic interconnection technology and interconnection materials, Shanghai Electronic Manufacturing Association, Shanghai Institute of Electronics, Shanghai Jiao Tong University, Osaka University in Japan as the important part of “2006 China International Industry Fair Forum” From November 17 to 18, 2006, the “2006 Shanghai International Forum on Electronic Interconnection Technologies and Materials” was jointly held in Shanghai. The contents of this forum include letters