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用飞行时间次级离子质谱(ToF-SIMS)结合银离化方法研究了集成电路封装用环氧模塑料的主要成分——邻甲酚环氧树脂.实验中测得n=0～4的树脂分子及相应的水解成分.碎片离子中除了芳香化合物通常具有的碎片外,还有反映树脂结构的碎片.通过对银离化碎片离子的分析,推断中间苯环上的侧链是最可能断裂的.
O-cresol epoxy resin, the main component of epoxy molding compound for IC packaging, was studied by TOF-SIMS combined with silver ionization method. The resin with n = 0 ~ 4 Molecules and corresponding hydrolytic components.Fragment ions in addition to the usual fragments of aromatic compounds, there are fragments of resin structure.Analysis of silver ionization fragment ions, infer the side of the middle benzene ring is the most likely to fracture .