近来,由于微细加工技术的进展,半导体器件的高集成化正迅速发展,每块芯片内集成的门数不断增加,并实现了短沟道化。这样,提高半导体器件的可靠性则日益成为重要课题。特别是塑料封装是降低成本的重要手段,因此必须提高处理芯片过程中的钝化技术。 到目前为止,集成电路的最终钝化膜主要采用化学汽相淀积磷硅玻璃。这对防止离子沾污来说,确实具有特别良好的钝化作用,但由于这种钝化膜中有一定浓度 Recently, due to advances in microfabrication techniques, high integration of semiconductor devices is rapidly evolving, and the number of gates integrated in each chip is constantly increasing, and short-channeling is achieved. In this way, increasing the reliability of semiconductor devices is increasingly becoming an important issue. In particular, plastic packaging is an important means to reduce costs, it is necessary to improve the processing of passivation technology chip. So far, the final passivation film of integrated circuits mainly uses chemical vapor deposition of phosphosilicate glass. This does have a particularly good passivation effect for preventing ionic contamination, but due to the fact that this passivation film has a certain concentration