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采用激光技术对Cu基材进行表面强化处理。使用扫描电镜(SEM)、电子能谱计(EDS)和X射线衍射仪(XRD)对强化表面进行显微组织和物相分析,并测试了样品的显微硬度、耐磨性能和导电性能。结果表明,激光强化层无裂纹,组织细小均匀、呈快速凝固特征,强化层具有较高的硬度(平均硬度为625HV0.1)和良好的耐磨性,其磨损失重仅为纯Cu基材的1/5,而激光表面强化使导电性略微降低。激光表面强化层硬度和耐磨性的提高可归因于颗粒强化、细晶强化和固溶强化的共同作用,而导电性的降低程度主要受稀释率的影响。
Surface treatment of Cu substrate by laser technology. The microstructure and phase analysis of the strengthened surface were carried out by using SEM, EDS and XRD, and the microhardness, wear resistance and electrical conductivity of the samples were tested. The results show that the laser strengthened layer has no crack, the microstructure is fine and uniform and has the characteristics of rapid solidification. The strengthened layer has high hardness (average hardness of 625HV0.1) and good wear resistance. The wear loss is only the pure Cu substrate 1/5, while the laser surface strengthens the conductivity slightly lower. The enhancement of the hardness and wear resistance of the laser surface enhancement layer can be attributed to the combined effects of grain strengthening, grain refining and solution strengthening, while the reduction in conductivity is mainly affected by the dilution rate.