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本文介绍了记忆合金薄板拉伸σ-ε曲线的电测方法。所测板厚在0.5mm～1.5mm范围效果最佳。从自动描绘的拉伸σ-ε曲线上可读出记忆材料在不同温度处由应力诱发马氏体转变所需临界值σ~(P,M);也可得出各温度下伪弹性回复量与形状记忆回复量的相对大小。每测一片试件不超过15分钟。初步解决了在非instron电子拉伸机上测定薄板记忆合金的拉伸σ-ε曲线问题。
This paper introduces the electrical measurement method of tensile σ-ε curve of memory alloy sheet. The measured thickness in the range of 0.5mm ~ 1.5mm best. From the automatically plotted tensile σ-ε curve, the critical value σ ~ (P, M) required for stress-induced martensitic transformation of the memory material at different temperatures can be read; and the pseudo-elastic recovery at each temperature And the relative size of the shape memory response. Each test piece does not exceed 15 minutes. The preliminary solution to the non-Instron electronic tensile testing thin-plate memory alloy tensile σ-ε curve problem.