将真空压铸(50%真空度)Al-Si-Cu合金试样在500℃固溶处理0.5、2、4和6 h以及进行500℃×4 h+530℃×6 h的固溶处理,利用光学显微镜和扫描电镜研究了真空压铸对Al-Si-Cu合金固溶处理过程表面起泡的影响。结果表明:相对于普通压铸,真空压铸试样基体更致密、内部气孔小且分散,固溶处理过程中起泡核心长大需要较长时间,表面起泡小于100μm的条件下,在500℃可固溶处理2 h;起泡核心距离表面越远、核心尺寸越小以及表面致密度、强度越高,表面起泡所需要的时间也越长。 The samples were vacuum-cast (50% vacuum) Al-Si-Cu alloy solution treatment at 500 ℃ 0.5, 2, 4 and 6 h and 500 ℃ × 4 h + 530 ℃ × 6 h solution treatment, The effects of vacuum die casting on the surface foaming of Al-Si-Cu alloy during solution treatment were investigated by optical microscope and scanning electron microscope. The results show that compared with ordinary die-casting, the samples of vacuum die-casting are more compact, the internal pores are small and dispersed, and it takes a long time for the foaming core to grow in the solution treatment. When the surface foaming is less than 100μm, Solution treatment 2 h; the farther the foaming core is from the surface, the smaller the core size and the higher the surface density and the higher the intensity, the longer the surface foaming takes.