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固体邏輯电路的制造工艺是一种新型微电子学装配工艺,采用带有玻璃夹层(glass-encapsulated)的硅平面型晶体管和二极管,用图形工艺(grphical arts techniques)制造高质量、高精度的无源元件。因而获得低成本、多用途、高性能的线路模块的方法。 固体邏輯工艺的特点是:半导体器件形式独特、模块的制造过程特殊和某些性能良好。更值得注意的是这种工艺能夠制成各种元件,如电感、电容和大功率晶体管。文章还举例了高速、高密度和复杂的电路装配件。
The manufacturing process for solid state logic is a new microelectronics assembly process that uses glass-encapsulated silicon planar transistors and diodes to create high-quality, high-precision, Source components. Thus obtaining a low-cost, multi-purpose, high-performance line module approach. Solid logic process is characterized by: a unique form of semiconductor devices, the module manufacturing process and some special good performance. Even more noteworthy is that this process can be made into a variety of components, such as inductors, capacitors and high-power transistors. The article also illustrates high-speed, high-density and complex circuit assemblies.