近日,华工激光自主研发的紫外激光晶圆切割机获首批国家自主创新产品认定。长期以来,我国在激光精密加工领域依靠进口,相关核心技术的研发进展缓慢。作为半导体芯片生产中的一个重要环节,晶圆切割划片技术不仅是芯片封装的核心关键工序之一,也是从圆片级的加工过渡为芯片级加工 Recently, laborers laser independent research and development of UV laser wafer cutting machine won the first batch of national independent innovation product certification. For a long time, China relies on imports in the field of laser precision machining, and the research and development of related core technologies have been slow. As an important part of the semiconductor chip production, wafer cutting and scribing technology is not only one of the core processes of chip packaging, but also from wafer-level processing to chip-level processing