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以一种有尾排气式真空封装器件为对象,从释放气体组分和放气量两方面对封装体内部放气特性进行了分析,旨在为器件的高真空度设计、提高器件寿命提供依据。首先,通过残余气体分析得到了各封装体内部的气体成分,推理出各构件所释放气体的具体组分;其次,通过真空电阻丝标定方法得到了各封装体内的压强变化,分析出各构件的放气量。研究结果表明,封装体内部的气体主要有:N_2,O_2,Ar,CO_2,H_2O,H_2,碳氢化合物,甲醇等,其中管壳是最大的气源,主要释放气体为H_2、H_2O;其次为银浆,主要释放气体为CO_2、N_2;最后为半导体制冷器,主要释放气体为H_2O、CO_2、N_2。
In order to provide a tailpipe-type vacuum packaging device, the characteristics of the outgassing of the package are analyzed from the aspects of gas release and the amount of deflation. The purpose is to provide a basis for the design of the device’s high degree of vacuum and the improvement of device lifetime . First, the gas composition of each package was obtained by residual gas analysis to infer the specific components of the gas released by each component. Secondly, the pressure variation in each package was obtained by the calibration method of vacuum resistance wire, Deflated volume. The results show that the gas inside the package is mainly N_2, O_2, Ar, CO_2, H_2O, H_2, hydrocarbons, methanol, etc. The shell gas is the largest gas source, the main release gas is H_2, H_2O, followed by Silver paste, the main release of gas as CO_2, N_2; Finally, the semiconductor cooler, the main release of gas H_2O, CO_2, N_2.