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科技部最近在京宣布,总投资达200亿元的“十五”期间12个重大科技专项已经正式批复启动实施,其中“超大规模集成电路和软件重大专项”位列榜首。我国将力争在2010年左右成为集成电路设计生产大国。在集成电路方面,项目将重点突破高性能 CPU 设计开发的核心技术,掌握以自主 CPU 为核心的系统芯片开发平台技术;建立国家级的 IP 核库,掌握与国际接轨的自主知识产权的 IP 核的开发、管理和应用技术;自主开发一批示范性 SOC 关键芯片;突破超深亚微米 IC 设计、IP 复用、软硬件协同设计、关键工艺模块等SOC 关键技术;支持一批国家级 IC 设计产业化基地,重点培育若干辐射全国的 MPW 服务中心。预计到2010年,我国将成为世界第二大半导体市场。巨大的市场需求将使我国电子信息产品制造业的产值增长率大大高于国民经济的增长速度,每年约为20%到50%。
Recently, the Ministry of Science and Technology announced in Beijing that 12 major scientific and technological projects with a total investment of 20 billion yuan have been formally approved for implementation during the “Tenth Five-Year Plan” period. Among them, “VLSI and major software projects” topped the list. China will strive to become a big country in the design and manufacture of integrated circuits by around 2010. In terms of integrated circuits, the project will focus on breaking through the core technologies of high-performance CPU design and development, mastering the system chip development platform technology with its own CPU as the core, establishing a national-level IP core database and mastering the IP core with independent intellectual property rights Development, management and application of technologies; Independent development of a number of key SOC chip demonstration; Breakthrough in ultra-deep submicron IC design, IP reuse, hardware and software co-design, key technology modules and other key SOC technologies; Support a number of national IC design Industrialization base, focusing on cultivating a number of radiation MPW service center. It is estimated that by 2010, China will become the second largest semiconductor market in the world. Huge market demand will make China’s electronic information product manufacturing output growth rate much higher than the national economy, annual growth rate of about 20% to 50%.