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研究了在３５±０．１℃、离子强度０．５ｍｏｌ／Ｌ（ＫＣｌ）条件下，甲酸根、乙酸根、丙酸根和丁酸根分别催化Ｃｕ（Ⅱ）离子与四溴化间－四（Ｎ－乙酸甲酯基－３－吡啶基）卟啉（Ｈ２ＴＢ－Ｎ－ＡＣＭＳｐｙＰＢｒ４）的反应动力学及其机理，该类反应对卟啉和Ｃｕ（Ⅱ）离子均为一级反应，反应动力学方程为：ｄ［Ｃｕｐ４＋］／ｄｔ＝ｋ｛（１．０＋ｂ［Ａ－］）／（１．０＋Ｋ３，４·［Ｈ＋］２）｝［Ｃｕ２＋］［ｐ］Ｔ，在甲酸－甲酸根缓冲体系中，ｋ＝２．９８ｍｏｌ－１ｄｍ３·ｓｅｃ－１，ｂ＝１５４×１０２ｍｏｌ－２，ｄｍ６·ｓｅｃ－１，Ｋ３，４＝６．９２８×１０３；在乙酸－乙酸根缓冲体系中，ｋ＝３．４２ｍｏｌ－１·ｄｍ３·ｓｅｃ－１，ｂ＝２．２９×１０３ｍｏｌ－２·ｄｍ６·ｓｅｃ－１，Ｋ３，４＝６．９２８×１０３；在丙酸－丙酸根缓冲体系中，ｋ＝３．００ｍｏｌ－１·ｄｍ３·ｓｅｃ－１，ｂ＝５．９０×１０２ｍｏｌ－２·ｄｍ６·ｓｅｃ－１，Ｋ３，４＝７．００７×１０３；在丁酸－丁酸根缓冲体系中，ｋ＝３．１４ｍｏｌ－１·ｄｍ３·ｓｅｃ－１，ｂ＝３．７５×１０２ｍｏｌ－２·ｄｍ６·ｓｅｃ－１，Ｋ３，４＝６．９２１×１０３；讨论了有机酸根的碱性与?
The effect of Cu (Ⅱ) ion and Cu (Ⅱ) ion on the interaction of Cu (Ⅱ) with tetrabromobistetrabromide (Ⅳ) was studied under the conditions of 35 ± 0.1 ℃ and 0.5mol / N-methyl acetate-3-pyridyl) porphyrin (H2TB-N-ACMSpyPBr4) reaction kinetics and its mechanism, such reactions on the porphyrin and Cu (Ⅱ) ions are the first reaction, the reaction kinetics The equation is: d [Cup4 +] / dt = k {(1.0 + b [A-]) / (1.0 + K3,4 · [H +] 2)} [Cu2 +] [p] T in formic acid- K = 2.98mol-1dm3sec-1, b = 154x102mol-2, dm6sec-1, and K3,4 = 6.928x103; in an acetic acid-acetate buffer system, k = 3 .42 mol-1 · dm3 · sec-1, b = 2.29 × 103 mol-2 · dm6 · sec-1, K3,4 = 6.928 × 103; k = 3.00 mol-1 · dm3 · sec-1 and b = 5.90 × 102 mol-2 · dm6 · sec-1 in propionate-propionate buffer system, = 7.007 × 103; k = 3.14 mol-1 · dm3 · sec-1, b = 3.75 × 102 mol-2 · dm6 · sec-1 in the butyrate-butyrate buffer system, 4 = 6.921 × 103; discussed the organic acid radical basic and?