论文部分内容阅读
采用磨片研抛、电解和磁场三重复合工艺对金属难加工材料镜平面进行研抛轨迹研究，分析了影响研抛轨迹的主要运动参数，找出了最佳研抛轨迹的主要工艺多数．
The grinding plane of the refractory metal was studied by using the grinding, polishing, electrolysis and magnetic field triple recombination process. The main kinematic parameters influencing the polishing trajectory were analyzed and the main technological process of the polishing trajectory was found out.