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日立高新技术公司发布了FEB(Field Emission Beam,场发射电子束)测长装置的新产品CG6300。该机型可满足7nm工艺元件开发和10nm工艺元件量产时的工艺控制需求,预定2015年10月开始销售。在7nm及10nm元件的微细化方法中,目前的主流是利用液浸曝光机实施LELELE(litho-etch-litho-
Hitachi High-Technologies Launches CG6300, a New Product of Field Emission Beam Measuring Device. The model can meet the process control requirements for the development of 7nm process components and 10nm process components for mass production. It is scheduled to start sales in October 2015. In the method of microfabrication of 7 nm and 10 nm elements, the current mainstream is the use of a liquid immersion lithography apparatus for performing litho-etch-litho-