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在气相沉积法或扩散法研制超导带的过程中,要确定和控制沉积层、扩散层(以下简称为扩散层)的厚度和生成相。由于制造工艺不同,生成的扩散层和相也不同。这些扩散层一般在15微米以下,甚至2微米以下。对这样的薄层,用金相法可以测定金属间化合物层的厚度。但不能确定元素组成和含量。而且因为金属间固溶体层,没有明显界线,所以用金相法测量往往极为困难或不可能。电子探针能较好地测量扩散层的厚度、
In the process of developing the superconducting tape by the vapor deposition method or the diffusion method, the thickness and the formation phase of the deposition layer, the diffusion layer (hereinafter simply referred to as the diffusion layer) are determined and controlled. Diffusion layers and phases are also different due to different manufacturing processes. These diffusion layers are typically below 15 microns and even below 2 microns. For such a thin layer, the thickness of the intermetallic compound layer can be measured by the metallographic method. But can not determine the elemental composition and content. And because the intermetallic solid solution layer, there is no clear boundary, so the use of metallographic method is often extremely difficult or impossible. Electronic probe can better measure the thickness of the diffusion layer,