我们与国际标准的制订同步、与国内电子元器件可焊性攻关紧密配合,进行了《润湿称量法可焊性试验》及其导则标准的制订工作。订出了可焊性的定量测试方法,在技术上达到了国际先进水平,解决了电子元器件的可焊性评定问题,促进了国内电子元器件可焊性水平的提高。 1、为什么要制订《润湿称量法可焊性试验》标准自1981年以来,我们就开始制订锡焊方面的基础标准,首先于1982年制订了GB2423·28—82《锡焊试验方法》和GB2424·17—82《锡焊试验导则》两项国家标准。它们对锡焊中的一些基本问题作出了规定,如试验条件,包括试验温度、所用焊料、焊剂、试验步骤和时间等,老化方法,包括高温老化、蒸汽老化及湿热老化等,可焊性试验方法,包 We synchronized with the development of international standards, and domestic electronic components work closely with the weldability, conducted a “wetting weighing method solderability test” and the guidelines for the development of standards work. A quantitative test method of solderability has been established, which has technically reached the international advanced level, solves the problem of solderability evaluation of electronic components and improves the solderability of domestic electronic components. 1, why should formulate “wetting weighing method solderability test” standard Since 1981, we began formulating the basic standards of soldering, first developed in 1982, GB2423 · 28-82 “solder test method” And GB2424 · 17-82 “Soldering Guide” two national standards. They set out some basic issues in soldering, such as test conditions including test temperature, solder used, flux, test procedure and time, aging methods including high temperature aging, steam aging and damp heat aging, weldability test Method, package