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为了探索低成本、大深宽比加工方法,建立了实用的准分子激光微加工系统。以玻璃为实验靶材,用精密微动平台准确调节靶材位置,利用波长248nm的KrF准分子激光器,研究了准分子激光直写刻蚀过程中平均刻蚀速率与激光脉冲能量密度之间的关系。加工出的沟槽剖面形状均呈现锥型,单脉冲烧蚀速率随脉冲数的增加而减小,激光脉冲对材料的刻蚀具有能量阈值,加工槽的深度具有上限值。采用平行激光束或对加工过程进行动态控制还可实现矩形深槽或圆柱深孔的加工。
In order to explore low-cost, large aspect ratio processing methods, the establishment of a practical excimer laser micro-processing system. Taking glass as the experimental target, the position of the target was accurately adjusted with a precision fretting platform. The KrF excimer laser with a wavelength of 248 nm was used to study the relationship between the average etch rate and the laser pulse energy density relationship. The shape of the groove is conical. The single-pulse ablation rate decreases with the increase of the number of pulses. The laser pulse has an energy threshold for material etching, and the depth of the processing groove has an upper limit. The use of parallel laser beams or dynamic control of the machining process also enables the machining of rectangular deep grooves or deep cylindrical holes.