用梯度烧结法连接钨铜合金与纯铜或铜合金,并与传统的整体烧结、焊接、机械螺纹连接进行了对比分析,观察了结合界面和拉伸断口。结果表明,梯度烧结试样可以显著提高结合界面的抗拉强度(15%～30%)、降低电阻率(25%)。而且梯度烧结试样的界面表现为“犬牙交错”状,断裂方式为准解理,优于界面较为平整,断口呈解理断裂的其他几种连接方式。 Gradient sintering method was used to connect tungsten copper alloy with pure copper or copper alloy, and compared with the traditional sintering, welding and mechanical screw connection, the bonding interface and tensile fracture were observed. The results show that the gradient sintered specimens can significantly improve the tensile strength of the bonded interface (15% ~ 30%) and decrease the resistivity (25%). Moreover, the interface of the sample with gradient sintering shows “interlaced ” shape, fracture mode quasi-cleavage, better than the interface is relatively smooth, cleavage fracture was several other connections.