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采用D311树脂吸附处理含高铜氰化提金尾液,分别考察了树脂添加量、吸附反应时间、反应温度、溶液p H等对铜氰络合离子吸附率的影响,获得了静态吸附最优工艺条件,并从热力学及动力学角度研究了D311树脂对铜氰络合离子的吸附特征。结果表明:当D311树脂吸附经硫酸铜沉淀预处理后的提金尾液时,在液固比(滤液与树脂体积比)为5∶1、溶液p H<9、室温、吸附反应时间135 min的优化工艺条件下,其对铜氰络合离子的吸附率可达98%以上。该吸附过程符合Freundlich吸附模型,为优惠吸附;吸附过程的速度控制步骤为颗粒扩散和化学反应共同控制。采用准一阶动力学模型和准二阶动力学模型分别对吸附动力学数据进行模拟,发现D311树脂对含高铜氰化提金尾液中铜氰络合离子的吸附符合准二阶动力模型,其理论吸附量为12.6023 mg·ml-1,与实验所测的平衡吸附量吻合,吸附速率常数k=1.236×10-2min-1。
The effects of resin addition amount, adsorption reaction time, reaction temperature and solution p H on the adsorption rates of copper cyanide complex ions were investigated by adsorption of D311 resin on the gold electrowinning solution containing high copper. The optimal static adsorption was obtained The adsorption characteristics of Cu2 + complex ions by D311 resin were studied from the aspects of thermodynamics and kinetics. The results showed that when the liquid-solid ratio (volume ratio of filtrate to resin) was 5:1, the solution pH <9, room temperature, adsorption reaction time 135 min Under the optimal technological conditions, the adsorption rate of copper cyanide complex ions can reach more than 98%. The adsorption process conforms to the Freundlich adsorption model and is preferential adsorption. The speed control of the adsorption process is controlled by particle diffusion and chemical reaction. The quasi-first-order kinetic model and quasi-second-order kinetic model were respectively used to simulate the adsorption kinetics data. It was found that the adsorption of copper-cyanide complex ions on the high-copper cyanidation gold tailings by D311 resin was in accordance with quasi-second-order kinetic model The theoretical adsorption capacity was 12.6023 mg · ml-1, which was consistent with the experimental equilibrium adsorption. The adsorption rate constant was k = 1.236 × 10-2min-1.