In some situations, the accelerated life test on environmental stress for electronic products is not easily implemented due to various restrictions, and thus engineers are lacking of data of the product life test. Concerning this problem, environmental life of the printed circuit board(PCB) board is calculated by way of physics of failure. Influences of thermal cycle and vibration on PCB and its components are studied. Based on the analysis of force and stress between components and the PCB board in thermal cycle events and vibration events, four life computing models of pins and soldered dots are established. The miller damage ratio is used to calculate the accumulated damage of a pin or a soldered dot, and then the environment life of the PCB board can be determined by the first failed one. Finally, an example is used to illustrate the models and their calculations. In some situations, the accelerated life test on environmental stress for electronic products is not easily due to to various restrictions, and thus engineers are lacking of data of the product life test. Concerning this problem, environmental life of the printed circuit board (PCB) Based on the analysis of force and stress between components and the PCB board in thermal cycle events and vibration events, four life computing models of pins and soldered dots are established. The miller damage ratio is used to calculate the accumulated damage of a pin or a soldered dot, and then the environment life of the PCB board can be determined by the first failed one. Finally, an example is used to illustrate the models and their calculations.