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为了克服粘着对微机电系统装配的影响,提出了一种利用液体桥力实现微球转移操作的方法。利用操作臂和微球之间的液体桥力实现微球的抓取,利用目标平面和微球之间的液体桥力实现微球的释放。对微球受力的理论分析表明,重力可以被忽略。由于干燥微球和粗糙平面之间的粘着力很小,抓取操作容易实现;释放操作要求操作臂末端的半径小,操作液体的界面能尽量低。使用该方法实现了一种微滚动导轨的装配,从而验证了该方法的可行性。
In order to overcome the influence of adhesion on MEMS assembly, a method of using liquid bridge force to transfer microspheres was proposed. The liquid bridge force between the manipulator arm and the microsphere is used to capture the microsphere, and the liquid bridge force between the target plane and the microsphere is used to achieve the release of the microsphere. The theoretical analysis of the forces exerted by the microspheres shows that gravity can be neglected. Due to the small adhesion between the dry microspheres and the rough surface, the grasping operation is easy to accomplish; the release operation requires a small radius at the end of the manipulating arm and a low operating liquid interface. The method is used to realize the assembly of a micro-rolling guide rail, thus verifying the feasibility of the method.