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在平行光互接应用的光收发器中,光纤对准占据了光电封装成本的一大部分。文章研究的光发送器和接收器由工作波长950nm的垂直腔面发射激光器(VCSELs)和谐振腔增强型(RCE)光检测器组成,并键合到单个双极型互补金属氧化物半导体(BiCMOS)芯片上。考虑到性能与生产成本,对不同的组装结构进行了研究。最终选择了利用倒装技术将光芯片键合到集成电路(IC)的方法。为实现光纤的被动无源对准,提出了在一片倒装焊了光芯片的IC上方叠放的硅片上蚀刻孔的设想。目前这样一种测试装置已由法国LETI开发出来,并通过它证明了采用这种方法能够获得高精度(μm)的光纤对准。
In optical transceivers for parallel optical interoperability, fiber alignment takes up a large part of the cost of optoelectronic packaging. The optical transmitters and receivers studied in this paper consist of vertical cavity surface emitting lasers (VCSELs) and resonant cavity enhanced (RCE) photodetectors operating at 950 nm and are bonded to a single bipolar complementary metal-oxide semiconductor (BiCMOS ) Chip. Taking into account the performance and production costs, different assembly structures were studied. The final choice of the use of flip chip technology will be bonded to the integrated circuit (IC) method. In order to realize the passive passive alignment of the optical fiber, a proposal was made to etch the hole on the silicon wafer stacked above the IC of a flip-chip-mounted optical chip. At present, such a test device has been developed by the French LETI, and through it to prove that with this method can obtain high-precision (μm) fiber alignment.