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以等截面悬臂梁为研究对象,分析了表面式封装工艺对光纤光栅传感器的应变传递特性的影响,推导了光纤光栅传感器所测应变与实际基体应变之间的关系,得到了应变传递率与平均应变传递率表达式。对影响平均应变传递率的参量进行了详细的仿真分析,结果表明为使光纤光栅能够真实地反映基体的形变,应选用剪切模量较大的物质作为中间层,减小中间层的厚度,增加中间层的长度和宽度,以提高平均应变传递率,减小测量误差。中间层厚度是影响封装结果一致性和重复性的最主要因素,而增大中间层长度和宽度,能有效地提高传感器封装结果的一致性和重复性。
Taking isosceles cantilever beam as the research object, the influence of the surface encapsulation process on the strain transfer characteristic of FBG sensor was analyzed. The relationship between strain measured by FBG sensor and the actual strain of the FBG sensor was deduced. The strain transfer rate and average Strain transfer rate expression. The parameters of the average strain transfer rate are analyzed in detail. The results show that for the FBG to reflect the deformation of the substrate, the material with larger shear modulus should be chosen as the middle layer and the thickness of the middle layer should be reduced. Increase the length and width of the middle layer to increase the average strain transfer rate and reduce the measurement error. The thickness of the middle layer is the most important factor that affects the uniformity and repeatability of the package. Increasing the length and width of the middle layer can effectively improve the consistency and repeatability of the sensor package.