Three-dimensional micro- and nanometre composite aluminium pattes are constructed on Al substrate by using photolithography, reactive ion etching and anodization. A layer of patteed SiO2 mask is introduced as resist on the surface of Al foil, and during anodization the tilted nanopores and remaining Al microstructure are formed undeeath the SiO2 mask. The existence of SiO2 mask leads to the deflection of electric field and effect on the transportation of ions, which results in the formation of laterally tilted nanopores, while the nanopores go down directly when being far from the boundaries of SiO2. The vertical and lateral anodization processes proceeding simultaneously construct the Al microstructure under the patteed SiO2 mask.