研究了Kapton H型聚酰亚胺膜在平行板反应室中用两种不同的气体混合物(O_2-CF_4和O_2-SF_6)的等离子体腐蚀。这两种情况都获得了高腐蚀速率(0.5～3μm/min)。观察到0.2Torr压力下反常的加载效应,可以认为,这种效应是聚酰亚胺释放出氮气的缘故。由质谱测定法探测到腐蚀过程中放出的气体,并指明氧原子和氟原子都是聚合物的主要腐蚀剂。为了给出反应过程的主要方法,与SF_6-O_2等离子体中的硅腐蚀进行了比较。腐蚀前和腐蚀后对聚酰亚胺表面的XPS(X射线光电子光谱学)测量与质谱测定法所观察到的结果是一致的。 Plasma etching of Kapton H type polyimide membranes using two different gas mixtures (O 2 -CF 4 and O 2 -SF 6) in parallel plate reactors was investigated. Both cases achieved high corrosion rates (0.5-3 μm / min). Anomalous loading effects were observed at 0.2 Torr pressure. It is believed that this effect is caused by polyimide releasing nitrogen. The gases emitted during the corrosion process are detected by mass spectrometry and indicate that both oxygen and fluorine atoms are the major caustic for the polymer. In order to give the main method of the reaction process, the silicon corrosion in SF_6-O_2 plasma was compared. The XPS (X-ray photoelectron spectroscopy) measurement of the polyimide surface before and after etching is consistent with the results observed with the mass spectrometry.