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对陶瓷修复体与预备体间有效的粘接有可能提高陶瓷修复体的抗折裂能力。本研究应用扫描电镜对Ｐｌａｔ铸造陶瓷表面用４％氢氟酸酸蚀１，２，５，７．５，１０，２０ｍｉｎ后的表面形态进行了观察。测试了陶瓷表面喷砂、４％氢氟酸酸蚀２，５，７．５，１０ｍｉｎ及酸蚀５ｍｉｎ＋ＫＨ－５７０处理后与树脂间的抗张粘接强度。结果表明：４％氢氟酸酸蚀２，５ｍｉｎ者可使陶瓷表面粗糙，形成孔隙，可增强其与树脂间的粘接强度，而延长酸蚀时间，陶瓷表面变平整，不利于粘接强度的提高。ＫＨ－５７０处理可进一步提高陶瓷与树脂间的粘接强度。
Effective bonding between the ceramic restoration and the preparation may increase the ability of the ceramic restoration to resist cracking. In this study, the surface morphology of Plat cast ceramic surface treated with 4% hydrofluoric acid for 1, 2, 5, 7.5, 10 and 20 min was observed by scanning electron microscopy. The tensile bond strength between the resin and the resin was tested after blasting the ceramic surface, etching with 4% hydrofluoric acid for 2, 5, 7, 5 and 10 min and acid etching for 5min + KH-570. The results show that 4% hydrofluoric acid etching for 2.5min can make the ceramic surface rough, forming pores, which can enhance the bonding strength between resin and resin, and extend the etching time, the ceramic surface becomes flat, not conducive to the bonding strength Improve. KH-570 treatment can further improve the bonding strength between ceramic and resin.