由于半导体器件工艺的干法化,各种离子束工艺越来越显得重要了。本文就其中的离子束曝光、离子束蚀刻以及聚焦离子束技术的最近进展情况进行论述。一、前言随着半导体器件的高密度化、高集成化,要使工艺技术满足:1)、超微细加工,2)、低温工艺,3)便于控制,4)净化工艺等的要求问题,越来越显得重要了。采 Due to the dry process of semiconductor devices, various ion beam processes are more and more important. This article discusses the progress of ion beam exposure, ion beam etching and focused ion beam technology. I. INTRODUCTION With the high density and high integration of semiconductor devices, it is necessary to satisfy the following requirements for process technology: 1) ultrafine processing, 2) low temperature process, 3) ease of control, 4) purifying process, etc., The more important the more important. Mining