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[会议论文] 作者:LU Guo-guang,HAO Ming-ming,Lai Can-xiong,Yao Bin, 来源:第十二届中国国际半导体照明论坛 年份:2015
We showed a detailed thermal simulation of a high power flip-chip packaged LED,simulation results show that the junction temperature of the LED is more sensitive to the adhesive layer material between...
[期刊论文] 作者:Jin-long Lu,Guo-guang Cheng,Meng Wu,Guo Yang,Ju-long Che, 来源:钢铁研究学报(英文版) 年份:2020
An unqualified six-cylinder heavy truck crankshaft has been studied to investigate the cause of magnetic particle testing defects on the rod joals. Large-sized...
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