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[会议论文] 作者：Ya-Wen Lin,Jui-Chao Kuo,Delphic Chen,
来源：第七届海峡两岸薄膜科学与技术研讨会 年份：2011
Due to its lower resistivity,higher thermal conductivity and better electromigration resistance copper has replaced aluminum for interconnect materials in the m...
[期刊论文] 作者：Kuo,Yu-Lueng Shih,Her-Young Su,Ming-De Yan,Chung-Bao Hsieh,Chin-Yu Liu,Wei-Ting Huang,Mu-Hsien Yu,Ya-Wen Lin,
来源：World Journal of Gastroenterology 年份：2015
AIM: To examine the methylation levels of interleukin-1 receptor-associated kinase 3(IRAK3) and GLOXD1 and their potential clinical applications in hepatocellul...
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