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[会议论文] 作者:Tae-Kwang Eom,Windu Sari,Soo-Hyun Kim,
来源:2011年第三届微电子及等离子体技术国际会议 年份:2011
Bilayers of Ru(7nm)/WSixNy(8nm) prepared by sputtering were investigated as diffusion barriers between Cu and Si for direct-plateable Cu interconnects and their diffusion barrier performances were com...
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