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Thermal Behavior of Flip Chip LED Packages using Electrical Conductive Adhesive and Soldering Method
[会议论文] 作者：Yuan,Tuo Zheng,Chao Huang,Chenglong Zheng,
来源：第十届中国国际半导体照明论坛 年份：2013
This paper investigated thermal behavior of three kinds of FC packages connected with AuSn,SAC305,and electrical conductive adhesive using 1-D thermal resistance circuit method,and finite element meth...
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