扩散粘结相关论文
铜是目前最具代表性的热管理、电子封装材料之一。其优点是热导率高、延展性好。但同时也有密度大，热膨胀系数高的缺点。而中间相沥......
Solid-state diffusion bonding has been done to produce transition joint between TC4 and QAl10-3-1. 5 at the temperature ......
Fe3Al and Cr18-Ni8 steel were bonded in vacuum and an interface was formed between Fe3Al and Cr18-Ni8 steel. Stress dist......
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IN718 超级合金结合的超级粘性和散开在这篇文章被学习。紧张率敏感索引 m 用张力的速度变化方法在不同温度和各种各样的起始的紧......
Quality Evaluation of Diffusion Bonded Joints by Electrical Resistance Measuring and Microscopic Fat
<正>Micro-structure related behavior of diffusion bonding joints is a crucial issue in device and reactor fabrication of......
Through eliminating voids not affecting the primary bonding process, and incorporating interlayer and flexible base mate......
