三维片上网络(Three-Dimensional Network on Chip,3D NoC)互连结构是三维集成电路(Three-Dimensional Integrated Circuit,3D IC)......

由于TSV通道具有高硬件代价和低可靠性的缺点,限制TSV通道数量的非全互连3D NoC得到广泛研究.在非全互连3D NoC中,路由器需要维护T......