【摘 要】
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Significant scientific efforts have been done recently in the field of development and design of advanced lead-free solder materials for high temperature application.Specific attention in these resear
【机 构】
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Department of Materials Science and Engineering,College of Materials,and Research Center of Material
【出 处】
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第十六届全国相图学术会议暨相图与材料设计国际研讨会
论文部分内容阅读
Significant scientific efforts have been done recently in the field of development and design of advanced lead-free solder materials for high temperature application.Specific attention in these researches has been directed to the copper-antimony-based alloys.And the Cu-Ni-Sb system is one of the important subsystems.
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