Semiconductor materials play a major role in the Controlled Collapse Chip Connection flipchips.We realised that these semiconductor materials are widely used in the manufacture of electronic devices for instance mobile phones and computers.These devices experience failure after a given period of time of their use.This motivated us to do the research in the area.We used five different semiconductor materials namely: silicon,lead,carbon,germanium and tin.The materials were in plate form with holes of 2m diameter at the center.We subjected the plates to a pressure of -100n/m2 using Analysis System (ANSYS) and analysed the stress levels experienced by the different semiconductor plates around the via in the flipchip.