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考古及文献资料显示中国古代镀锡和焊接技术具有悠久的历史。利用扫描电子显微镜、金相和矿相显微镜,对我国出土的镀锡和焊接样品截面进行分析,发现镀锡层/青铜基体、铅锡焊料/青铜基体具有共同的界面特征,即有铜锡金属间化合物由界面向镀锡层或焊料深入,其生成原因是在热镀锡或焊接时熔化成液相的锡或铅锡焊料与基材青铜接触,基材中的铜溶解在熔融的锡或铅锡焊料中与锡发生反应,在界面处生成铜锡金属间化合物并向镀锡层或焊料中生长。分析还显示镀锡和焊接样品在界面生成的金属间化合物有所不同,镀锡样品有铜锡ε相、η相,还有δ相(Cu_(41)Sn_(11));而焊接样品未见δ相存在,仅发现有η相(Cu_6Sn_5)。其原因与镀锡操作的特点有关,镀锡有可能在热镀后,又经过一个退火的过程。
Archeology and literature show that ancient Chinese tin plating and welding technology has a long history. Using scanning electron microscopy, metallographic and optical microscope to analyze the cross-section of tin-plated and welded samples unearthed in our country, it is found that the tin-plated layer / bronze matrix and the tin-lead solder / bronze matrix have common interface characteristics, The intermetallics penetrate from the interface to the tinplate or to the solder due to contact between the tin or lead tin solder melted into the liquid phase during hot tin plating or soldering and the base bronze dissolved in molten tin or Tin-lead solder reacts with tin to form copper-tin intermetallics at the interface and grows to tin plating or solder. The analysis also showed that the intermetallic compounds formed at the interface between tin-plated and soldered samples were different. The tinned samples were tin-copper ε phase, η phase, and δ phase (Cu_ (41) Sn_ (11) See δ phase exist, only found η phase (Cu_6Sn_5). The reason is related to the characteristics of tin plating operation. Tin plating may be annealed after hot-plating.