In the highly competitive photovoltaics market, manufacturers of solar cells and modules are under constant pressure to reduce the manufacturing costs.Next to the silicon wafer the main cost driver of solar cells is the metallization, especially the front-side silver (Ag).Reduction of the silver consumption is the topic of several investigations; to completely replace silver by relatively cheap copper more advanced process flows are needed.In this paper two advanced metallization processes are investigated: inkjet printing of a silver nanoparticle ink for front-side metallization with reduced silver consumption and inkjet printing of a masking ink for subsequent Ni-Cu plating to completely replace silver with cheaper metals such as nickel (Ni) and copper (Cu).