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Heat pipes are two-phase heat transfer devices with extremely high effective thermal conductivity. In this paper, high thermal conductivity condenser and evaporator regions have been integrated into porous wick heat pipes and heat spreaders structure fabricated into an LTCC interconnect substrate. This paper aims to provide a thermal model for simulating the performance of a heat pipe system for T/R modules with high heat flux. By analyzing the temperature distribution, the maximum temperature of the T/R module arrays drops from 1560℃ to 117℃ after installing six heat pipes in one T/R module.