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板级电路可制造性分析及虚拟设计技术是一项前沿技术,是提高电路设计质量,加快产品研制周期,实现一次设计成功,建立电子装备快速反应平台的必由之路。在详细论述了印制电路板设计可制造性分析、人工评审的现状及可制造性分析软件系统应用的基础上,提出了开展“印制电路板电气互联可制造性虚拟设计”的必要性及实施方案。
Board-level circuit manufacturability analysis and virtual design technology is a cutting-edge technology, which is the only way to improve the quality of circuit design, speed up product development cycle, achieve a successful design and establish a rapid response platform for electronic equipment. After elaborating on the manufacturability analysis of printed circuit board design, the status quo of manual evaluation and the application of manufacturability analysis software system, the necessity of carrying out the “virtual design of manufacturability of electrical interconnection of printed circuit board” implementation plan.