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通常情况下,对于铜及铜合金均选用电解抛光或化学抛光后再用氯化铁盐酸水溶液擦拭的方法显示晶粒度,这种侵蚀剂主要是通过侵蚀位向不同的晶面来达到显示晶粒的目的.因反差强,对于晶粒较大的铜及铜合金效果较好,但对于厚度仅为0.08mm左右、强度≥400N的锡青铜带,用上述方法显示其晶粒存在一定的困难.同时我们因无电解抛光设备,制样更加困难.为了解决这一问题,在参考有关资料的基础上,经过多次试验,用氯化铜氨水溶液侵蚀锡青铜带的晶粒,效果较好.1 制样过程先将试样用镶嵌机镶成(?)15mm的标准试样,经粗、精磨后抛光.精磨砂纸粒度为W10(04~#),抛光选用W1.5金刚石抛光膏即可.整个磨抛过程中用力要轻,时间不能太长.
Under normal circumstances, for copper and copper alloys are selected electrolytic polishing or chemical polishing and then wrought iron chloride hydrochloric acid solution to show the grain size, this etchant is mainly through the erosion of the bit to a different crystal plane to display the crystal Because of the strong contrast, the effect is good for the larger grains of copper and copper alloy, but for the tin bronze belt with the thickness of only about 0.08mm and the strength of ≥400N, there are some difficulties in displaying the grains by the above method At the same time, because of the electroless polishing equipment, the sample preparation is more difficult.In order to solve this problem, on the basis of the relevant information, after several tests, with copper chloride ammonia solution eroded tin bronze grain, the effect is better .1 Sample Preparation The sample was first inlaid with a mosaic machine (?) 15mm standard sample, after roughing, fine polishing. Fine grinding paper size W10 (04 ~ #), polished W1.5 diamond polishing Cream can be used throughout the grinding and polishing force to light, the time can not be too long.