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基片集成同轴线是一种由基板上下导体板、内导体和金属化过孔阵列构成的集成波导结构,具有低损耗,宽频带,抗干扰,易于集成等优点。在基片集成同轴线的基础上,一种新型的多通道并行传输的基片集成同轴互连阵列结构被提出。该阵列结构通过相邻通道之间共用外导体的方式提高了互连的集成度,同时保持了良好的抗串扰特性。该互连阵列结构采用低温共烧陶瓷工艺(LTCC)加工实现,并应用了一种与之相匹配的共面波导转接结构。经过测试,基片集成同轴互连阵列结构中单个通道的带宽可以实现从直流到40GHz,单通道传输速率可以达到30Gbps,相应的十五通道互连阵列的总传输速率达到450Gbps。在PRBS序列周期为27-1的测试条件下,误码率小于10-12。
The substrate integrated coaxial line is an integrated waveguide structure composed of upper and lower conductor plates, inner conductors and metallized via arrays on the substrate, which has the advantages of low loss, wide band, anti-interference and easy integration. Based on the substrate integrated coaxial line, a new type of multi-channel parallel transmission substrate integrated coaxial interconnect array structure is proposed. The array structure improves the integration of interconnections by sharing the outer conductors between adjacent channels while maintaining good anti-crosstalk characteristics. The interconnect array structure is fabricated using a low-temperature co-fired ceramic process (LTCC) process and employs a matching coplanar waveguide transition structure. After testing, the bandwidth of a single channel in the substrate integrated coaxial interconnection array structure can achieve from DC to 40GHz, the single channel transmission rate can reach 30Gbps, and the corresponding fifteen channel interconnection array has a total transmission rate of 450Gbps. Under the test conditions of a PRBS sequence period of 27-1, the bit error rate is less than 10-12.