提出了一种补偿刻蚀法 :在经过常规光刻热熔成形和离子束刻蚀技术制成的硅微透镜阵列上再涂敷几层光刻胶 ,以降低各单元微透镜的曲率 ,然后再次进行加热固化和离子束刻蚀。扫描电子显微镜 ( SEM)显示微透镜阵列为表面极为平缓的球冠形阵列 ,表面探针测试结果显示用补偿刻蚀法制作的微透镜的 F数和 F′数分别可达到 31.62和 35.88,而常规光刻热熔法很难制作出 F数和 F′数分别超过 1.0 0和 4 .0 0的微透镜阵列。光学填充因子也由常规方法的 64.3%提高至78.5% ,并且微透镜的点扩散函数也更接近理想值 A compensating etching method is proposed: a few layers of photoresist are further coated on a silicon microlens array made by conventional lithography hot-melt forming and ion beam etching to reduce the curvature of each unit microlens, and then Heat curing and ion beam etching again. Scanning electron microscopy (SEM) shows that the microlens array is a very smooth spherical crown array. The surface probe test results show that the F number and the F ’number of the microlens fabricated by offset lithography can reach 31.62 and 35.88, respectively. Conventional lithography hot-melt method is difficult to produce a F number and F ’number respectively over 1.0 0 and 4. 0 0 microlens array. The optical fill factor is also increased from 64.3% to 78.5% of the conventional method, and the point spread function of the microlenses is closer to the ideal