研究了微量元素Mn和Zn对低银Sn-Ag-Cu无铅钎料钎焊接头组织和性能的影响。结果表明,Mn和Zn可使钎焊界面金属间化合物层(Cu3Sn和Cu6Sn5)变得薄而均匀;其可以增加低银钎料的钎焊接头的拉伸强度和剪切强度,最佳元素添加量为0.2%Zn和0.05%Mn(质量分数);断口形貌显示其接头为塑性断裂破坏。Mn、Zn的添加,使得钎料组织的方向性生长状态弱化,同时,可以抑制Cu6Sn5和Cu3Sn金属间化合物层在高温环境下的时效长大或粗化,表明其对接头的稳定可靠性也具有改善作用。 The effects of trace elements Mn and Zn on microstructure and properties of low silver Sn-Ag-Cu lead-free solder brazed joints were studied. The results show that Mn and Zn can make the intermetallic compound layer (Cu3Sn and Cu6Sn5) of the brazing interface thin and uniform. It can increase the tensile strength and shear strength of the brazed joints of low silver solder. The best addition of elements The amount of 0.2% Zn and 0.05% Mn (mass fraction); fracture morphology shows that the joints of plastic fracture failure. The addition of Mn and Zn weakens directional growth of brazing filler metal and inhibits the aging of Cu6Sn5 and Cu3Sn intermetallic compound layer from growing or coarsening at high temperature, Improve effect