微机械敏感元件对于检测多种特性具有很大潜力。到目前为止，成为商品的敏感元件仅限于检测压力和加速度。为了扩大使用范围为确保其可靠性并降低封装成本，我们认为目前的主要问题是在封装的研制方面。为了对侵蚀性媒质敏感，要对传感器进行不同程度的封装。本文深入讨论和比较了对传感器的封装方法，着重讨论了保护薄膜及直接与媒质相接触的敏感元件安装的封装方法，并给出了芯片加工工艺对传统材料的限制，其中包括不良的化学稳定性 Micromeritically sensitive components have great potential for testing a wide variety of properties. So far, the sensitive components that become commodities are limited to the detection of stress and acceleration. In order to expand the use of the package To ensure its reliability and reduce packaging costs, we believe that the current main problem is in the development of packaging. In order to be sensitive to aggressive media, sensors must be encapsulated to varying degrees. This paper discusses and compares the sensor packaging methods in depth, and discusses the packaging methods of the protective films and the sensitive components directly in contact with the media. The limitations of the traditional processing methods of the chips, including the poor chemical stability Sex