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研究了用相场法模拟纯物质过冷熔体枝晶生长过程中,界面厚度的取值对模拟结果可靠性的影响及影响界面厚度取值的因素;然后,在选取合理界面厚度取值的基础上,计算了不同过冷度下纯镍过冷熔体枝晶生长的速度并与实验进行了比较,研究表明:为了获得可靠的计算结果,界面厚度的取值应足够小;合理的界面厚度的取值由过冷度、各向异性、界面动力学、热扩散系数等参数综合决定;在选取合理界面厚度的基础上,模拟结果与实验吻合,证明界面厚度足够小时可获得可靠的模拟结果,为相场法模拟过冷熔体技晶生长时的界面厚度参数的取值提供了依据。
The influence of the interface thickness on the reliability of simulation results and the factors affecting the thickness of the interface during the growth of pure material undercooled melt by phase-field method was studied. Then, On the basis of this, the growth rate of pure nickel undercooled melt under different undercooling was calculated and compared with the experimental results. The results show that in order to obtain reliable calculation results, the thickness of the interface should be small enough. The reasonable interface The thickness is determined by parameters such as undercooling, anisotropy, interface dynamics and thermal diffusivity. Based on the reasonable thickness of the interface, the simulation results are in good agreement with the experimental results. It is proved that the interface thickness is small enough to obtain a reliable simulation The results provide the basis for the phase field method to simulate the interface thickness parameter of the undercooled melt crystal growth.