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在摩尔定律的指导下,IC上可容纳的晶体管数目,约每隔18个月便会增加一倍,性能也将提升一倍。IC上晶体管的不断增加为芯片的集成和融合奠定了物质基础。可以说,半导体IC的发展之路,就是一个不断走向集成和融合的道路。从单一的数字芯片、模拟芯片到混合信号的片上系统,再到不久前提出的3D封装,芯片的融合正在不断深入。近来,半导体行业有两个收购,从这两个收购上也可以看出半导体厂商为向进一步的集成和融合所做出的准备。一个是Altera收购电源技术创新者Enpirion公司,另
Under the guidance of Moore’s Law, the number of transistors that can be accommodated on the IC doubles every 18 months and the performance will be doubled. The growing number of transistors on ICs has laid the material foundation for the integration and integration of the chips. It can be said that the development of semiconductor IC, is a continuous integration and integration of the road. From a single digital chip, analog chip to mixed-signal system-on-chip, and then to the recent 3D packaging, chip fusion is in-depth. Recently, there have been two acquisitions in the semiconductor industry. From these two acquisitions, it is also clear that semiconductor manufacturers are preparing for further integration and integration. One is Altera acquired Enpirion, a power technology innovator, and the other