论文部分内容阅读
针对半导体器件微结构侧壁关键尺寸检测需求,设计了一套三维原子力显微镜(3D-AFM)系统.该系统采用针尖末梢为喇叭口形的悬臂梁探针,以扭转谐振模式实现横向轻敲扫描.介绍了该3D-AFM系统的结构组成和工作原理,对系统的横向检测灵敏度进行了标定,获得了喇叭口针尖与样品侧壁横向接近过程中探针扭转振幅的变化曲线.利用该系统对栅格标样侧壁局部形貌进行了线扫描和面扫描,所得轮廓具有较好的重复性,且测量所得形貌特征与常规轻敲模式扫描结果一致,表明本文所述3D-AFM系统及工作模式能够用于微结构侧壁形貌的检测.
A 3D AFM system was designed to detect the critical dimension of the microstructured sidewalls of semiconductor devices. The system uses a cantilever beam probe with a tip of the tip as a bell-shaped horn to achieve horizontal tapping scanning in a torsional resonance mode. The structure and working principle of the 3D-AFM system are introduced, the transverse detection sensitivity of the system is calibrated, and the change curve of the torsional amplitude of the probe during the transverse approach of the flare tip and the sample sidewall is obtained. The line-scan and area-scan of the local topography of the sidewalls of the standard samples were performed with good repeatability. The measured topographic features were consistent with the results of the conventional tapping mode scanning. It is shown that the 3D-AFM system and the working The mode can be used for the detection of microstructural sidewall morphology.