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本文通过可控塌陷芯片连接（Ｃ_４）技术及Ｃ_４技术在从芯片到多层基板，再从多层基析到ＰＣＢ上的安装互连所起的重要作用的介绍，论述了Ｃ_４技术的优越性能。Ｃ_４技术能与常规的ＳＭＴ相兼容，从而为实现工业化规模生产展示了诱人的前景。
This paper introduces the important function of C_4 technology and C_4 technology in the process of mounting and interconnecting C_4 technology from chip to multi-layer substrate and then from multi-layer base to PCB. . The C_4 technology is compatible with conventional SMT, demonstrating an attractive prospect for industrial-scale production.