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由于使用先进的多层陶瓷(MLC)基板这种新组装技术,在IBM3081的处理单元中实现了高性能大规模集成电路组装。这就是热传导模块(TCM:thermal conduction module),它是在90mm 见方的多层陶瓷基板上安装118个大规模集成电路芯片。在基板上平均有长130m 的阻抗匹配的布线,在基板表面呈阵列状地布置121个凸台,以便把集成电路焊接在底座上。基板中有1800条引线,通过这些引线将模块连接到印制电路底板上。设计散热量可到300瓦。本文概略地论述了这种模块的设计和制造技术。同时从安装密度、可靠性、性能等方面与以往的技术作了比较。
Due to the new assembly technology using an advanced multilayer ceramic (MLC) substrate, high-performance LSI assembly is implemented in the processing unit of the IBM3081. This is the TCM (thermal conduction module), which is to install 118 large-scale integrated circuit chips on 90mm square multi-layer ceramic substrate. An average of 130 m of impedance matching wires are arranged on the substrate, and 121 bosses are arrayed on the surface of the substrate in order to solder the integrated circuit to the submount. There are 1800 leads in the board, through which the module is connected to the printed circuit board. Design heat dissipation up to 300 watts. This article briefly discusses the design and manufacture of this module. At the same time from the installation density, reliability, performance and other aspects of the technology compared with the past.